Lead-free Solders: Materials Reliability for Electronics

  • Publish Date: 2012-04-02
  • Binding: Hardcover
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Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:

  • Phase diagrams and alloy development
  • Effect of minor alloying additions
  • Composite approaches including nanoscale reinforcements
  • Mechanical issues affecting reliability
  • Reliability under impact loading
  • Thermomechanical fatigue
  • Chemical issues affecting reliability
  • Whisker growth
  • Electromigration
  • Thermomigration

Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.



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